Can you ask your customer more about "WHY" he wants this specification?  To me, more is left unsaid, than is specified.  If he really wants 1.0 mil of conductor thickness on the surface - could it be for solder mask coverage, for flatness for bottom-terminated-components, BGA pads, etc?   

I am willing to bet that the customer wants 1.0 mils of plating in any via holes or component mounting holes to prevent cracks and/or blow holes there.  BUT, he may not know that specifying plating of 0.5mils on the surface makes it almost impossible to plate 1.0 mil in the holes.  This spec can be met with "tricks" like heavy microetch to thin the starting foil, use of the newer "via fill" acid copper electroplate, or mechanically sanding the panel surface at some point to get 1.0 mil thickness. 

However, I am willing to bet this is just poor communication of actual desires for the finished product. 

Denny Fritz



-----Original Message-----
From: Gerry Gagnon <[log in to unmask]>
To: TechNet <[log in to unmask]>
Sent: Thu, Feb 28, 2013 12:42 pm
Subject: Re: [TN] Notes in PCB Fabrication


Hi JF, You would be best served to get a copy of IPC-6012 and study the 
pecifications for copper thickness in there.Although I have a lengthy PWB 
istory, I think the specifications within are very clear even for those that 
ay not. Best regards, Gerry
> Date: Thu, 28 Feb 2013 11:44:58 -0500
 From: [log in to unmask]
 Subject: [TN] Notes in PCB Fabrication
 To: [log in to unmask]
 
 Hello All!
 
 I'm having a curious note in a fabrication drawing and I would like to 
 know if it makes sense.
 
 "1.0oz FINISH (0.5oz COPPER + 0.5oz PLATING)"
 
 And somewhere else in the notes, ENIG is specified...
 
 Ideas?
 
 JF
 
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