Hi all,
first I will give an 'eloge'  to Greg for his comment.
second a NTC matter. I have uploaded a 3 minutes long song under the folder
'Reports for Technet/NTC'.  My favorite singer. When she does  this one the
hair rise all over my body. Can you guess who she is? The one who is
correct will get a copy of the most deep diving Tin whisker report I have
seen. I've got permission for one and only one copy, more than 100 pages,
not known within the  USA . And he/she who wins has no right to copy to
others.

Just ONE guess!

Inge



On 23 February 2013 20:39, Gregory Munie <[log in to unmask]> wrote:

> I have been following this QFN discussion as about a year ago I worked a
> reliability problem for a QFN user.
>
> One thing I noted is that the standoff is (of course) low. For anybody who
> is using QFNs: Have you done a Werner Engelmaier style mechanical
> reliability analysis on the parts?
>
> Just asking. I saw them being used for avionics and was a little concerned
> about whether any planes I was to be flying on used QFNs.
>
> Greg Munie PhD
> IPC Technical Conference Director
> 630-209-1683
> [log in to unmask]
>
>
>
>
> http://www.ipcapexexpo.org/
> http://www.ipc.org
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Schaefer
> Sent: Saturday, February 23, 2013 11:33 AM
> To: [log in to unmask]
> Subject: Re: [TN] 48-pin QFN via-in-pad solder slug problem.
>
> I am currently working on a design with 2 similar QFNs requiring via in
> slug for thermal and electrical reasons.
> IPC-4761 gives a good summary of methods for handling these components;
> IPC-4761 Type VII (filled and conductively capped) appears to be the only
> sure bet solution.
>
> ______________________________________________________________________
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