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February 2013

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Subject:
Re: 48-pin QFN via-in-pad solder slug problem.
From:
Dave Schaefer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dave Schaefer <[log in to unmask]>
Date:
Sat, 23 Feb 2013 11:33:26 -0600
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I am currently working on a design with 2 similar QFNs requiring via in slug for thermal and electrical reasons.
IPC-4761 gives a good summary of methods for handling these components; IPC-4761 Type VII (filled and conductively capped) appears to be the only sure bet solution.

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