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February 2013

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Subject:
From:
Lum Wee Mei <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lum Wee Mei <[log in to unmask]>
Date:
Mon, 18 Feb 2013 00:00:44 +0000
Content-Type:
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How do I access into your dropbox?

Thanks and regards,
~wee mei~

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
Sent: Friday, February 15, 2013 6:22 AM
To: [log in to unmask]
Subject: Re: [TN] Buried/blind/stacked via layups

Why not look in my Dropbox under PWB, there is a IBM article about HDI.
Inge

On 14 February 2013 15:44, Wayne Thayer <[log in to unmask]> wrote:

> On high density boards, they are generally built on a "normal" core, 
> then have microvia layers added simultaneously to top and bottom, one 
> layer at a time (also called "sequential layup").
>
> To increase density, microvias can be filled, then outer layer vias 
> can be stacked directly on top.
>
> Is it OK to do the same with the core layer vias?  Fill, overplate, 
> then stack microvias on top of them?
>
> Thanks,
>
> Wayne Thayer
>
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