I thought I just saw a message go past that the Dropbox got updated!

Thanks much Inge.  I am in awe of the knowledge you have organized!

Wayne

From: Inge Hernefjord [mailto:[log in to unmask]]
Sent: Thursday, February 14, 2013 5:22 PM
To: TechNet E-Mail Forum; Wayne Thayer
Subject: Re: [TN] Buried/blind/stacked via layups

Why not look in my Dropbox under PWB, there is a IBM article about HDI.
Inge
On 14 February 2013 15:44, Wayne Thayer <[log in to unmask]<mailto:[log in to unmask]>> wrote:
On high density boards, they are generally built on a "normal" core, then have microvia layers added simultaneously to top and bottom, one layer at a time (also called "sequential layup").

To increase density, microvias can be filled, then outer layer vias can be stacked directly on top.

Is it OK to do the same with the core layer vias?  Fill, overplate, then stack microvias on top of them?

Thanks,

Wayne Thayer

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