Why not look in my Dropbox under PWB, there is a IBM article about HDI.
Inge

On 14 February 2013 15:44, Wayne Thayer <[log in to unmask]> wrote:

> On high density boards, they are generally built on a "normal" core, then
> have microvia layers added simultaneously to top and bottom, one layer at a
> time (also called "sequential layup").
>
> To increase density, microvias can be filled, then outer layer vias can be
> stacked directly on top.
>
> Is it OK to do the same with the core layer vias?  Fill, overplate, then
> stack microvias on top of them?
>
> Thanks,
>
> Wayne Thayer
>
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