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February 2013

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Subject:	Re: Testability Guidelines
From:	Jack Olson <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Thu, 28 Feb 2013 10:20:02 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (48 lines)

I'm not the best person to address that, but one thing I've heard that
might be of interest to you is:
You might get good contact the first time, but if you have to adjust
something or fix something or whatever,
its difficult to get a second or third reading because the bumps will be
mashed down.

Maybe that comment was just the frustration of getting the process dialed
in to begin with, but since you asked...

Jack

On Thu, Feb 28, 2013 at 10:13 AM, Pete <[log in to unmask]> wrote:

> Does anyone have experience using the solder bump method for exposing nets
> to ICT?  I'm working on a board now that may not be testable any other way.
>
> Pete
>
>
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