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Date: | Tue, 15 Jan 2013 16:25:12 +0000 |
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There are many divine principles, disciplines, mandates and theoretical dogmas that have not made their way into IPC-2221, why would you expect this question, with all the good previously alluded to variables and potential mitigating scenarios, to be covered with a standard keep-out area?
Since you asked again I'll accept your naiveté on this subject matter and state; 0.025 " keep-out clearance from edge of hole to nearest pad geometry.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Tuesday, January 15, 2013 8:37 AM
To: [log in to unmask]
Subject: Re: [TN] Mounting Hardware to QFP Component Lead
True, but I can't help but wonder if I'm missing something...
Of all the issues that the IPC committees have discussed over the last few DECADES, why can't I find anything about mounting structures to component clearance?
hmmm... dar's gotta be sumpn 'bout dat!
thanks anyway,
Jack
.
On Mon, 14 Jan 2013 19:16:27 +0000, Wayne Thayer <[log in to unmask]<mailto:[log in to unmask]>> wrote:
>If it is a new QFP with the pure copper/very high copper leads then I wouldn't worry about it. Those leads are so compliant they can absorb amazing amounts of stress.
>
>Wayne Thayer
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
>Sent: Monday, January 14, 2013 11:36 AM
>To: [log in to unmask]<mailto:[log in to unmask]>
>Subject: [TN] Mounting Hardware to QFP Component Lead
>
>To the assembly professionals out there:
>
>Have you ever had reliability issues with mounting screws if they are near a Quad Flat-Pack? My 144 pin land pattern is pretty close (100mils) but we are mounting the board into a very flat structure (no bowing) I can't imagine the compression of the board material could affect gull-wing style lead connections (maybe BGA?) but I don't know...
>
>thanks,
>Jack
>
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