Sounds more like a solderability improvement operation. I'll check what my
notes say ( was doing a lot such things twenty years ago)
/Inge




On 8 January 2013 18:07, Ramakrishnan Saravanan <[log in to unmask]>wrote:

> Dear all ,
>
> We are making MLBs for high reliability applications.
>
> Some users of our PCB asking us to do 3 dip test ( 3 x 280 deg C Solder
> dip).
>
> Is this test can be traced to any standard ?.
>
> regards,
>
> R.Saravanan
>


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