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January 2013

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Subject:
From:
Ramakrishnan Saravanan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ramakrishnan Saravanan <[log in to unmask]>
Date:
Tue, 8 Jan 2013 11:07:58 -0600
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Dear all ,

We are making MLBs for high reliability applications. 

Some users of our PCB asking us to do 3 dip test ( 3 x 280 deg C Solder dip). 

Is this test can be traced to any standard ?. 

regards,

R.Saravanan

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