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January 2013

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Subject:
Re: reliability test for PCBs
From:
Ramakrishnan Saravanan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ramakrishnan Saravanan <[log in to unmask]>
Date:
Tue, 1 Jan 2013 10:09:30 -0600
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Dear all, 

The test method 2.4.13.1 specifies  test method that is designed to determine the thermal integrity of unclad or metallic clad laminates using short-term solder exposure. My interest is to find the toughest know standard for PTH integrity. regards,


R.Saravanan

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