TECHNET Archives

January 2013

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wenger, George M.
Date:
Tue, 1 Jan 2013 09:55:48 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
Check IPC-TM-650_Section 2.4.13.1

Regards,
George
George M. Wenger
Senior Principal Reliability / FMA Engineer
Andrew Corporation - Wireless Network Solutions
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 Office (732) 309-8964 Mobile
E-mail: [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ramakrishnan Saravanan
Sent: Tuesday, January 01, 2013 10:53 AM
To: [log in to unmask]
Subject: [TN] reliability test for PCBs

Dear all, 

We have been fabricating high reliability PCBs for space applications. We are procuring from the contract suppliers also. What is toughest reliability tests as per any standard?. Some does 3 DIP test  @280 Deg C which i could not trace to any known standard. Single float test as per MIL-PRF-55110 may be suitable for olden days wave soldered assemblies. Some does  6 re flow test. Again i am not able to trace to any known standard. 

regards,

R.Saravanan


 

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2