I vote on non-functional pads out. You get an area that is resin poor if
you have a stack of non-functional pads. The stack of pancakes, as it
were, "telegraphs" the image of the pads to the outer layers. The resin
in the stack is depleted because there is copper on every layer.

What we suggest is to leave three or four non-functional pads in but not
in the center zone of the board.

Sincerely,  

 

Paul Reid 

Program Coordinator  

PWB Interconnect Solutions Inc. 
235 Stafford Rd., West, Unit 103 
Nepean, Ontario Canada, K2H 9C1 

613 596 4244 ext. 229  

Skype paul_reid_pwb 
[log in to unmask] 

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Bealer
Sent: January 17, 2013 4:13 PM
To: [log in to unmask]
Subject: [TN] PCB design/build question about via construction

On an internal copper plane(pour) where a via intersects the plane but
doesn't connect, should we remove the pad on that plane for that via?  I
would think that it would add some measure of structural support for the
via if we left it in place.  Am I wrong?

Thanks,
David Bealer

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