By removing pads in inner layer,  barrel will more likely crack during temperature cycling. Inner vias act as reinforcement of the barrel. 

Regards,

Cedric ORAIN
Inovelec



-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]] De la part de James Mahoney
Envoyé : vendredi 18 janvier 2013 14:27
À : [log in to unmask]
Objet : Re: [TN] PCB design/build question about via construction

In the old days I always preferred to remove them "non-functional pads" because they could cause slivers and cause shorts. Now a days with plating chemistries so advanced and not requiring flash plating etc.... I am not sure anymore. I have a 4 layer rigid flex with a few vias that only connect to the outer layers and they seem to be the places were more of the opens occur.

Thank you, Jim Mahoney 
Mass Design Inc.
Applications Engineer 
P# 603-886-6460 X215
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Bealer
Sent: Thursday, January 17, 2013 4:13 PM
To: [log in to unmask]
Subject: [TN] PCB design/build question about via construction

On an internal copper plane(pour) where a via intersects the plane but doesn't connect, should we remove the pad on that plane for that via?  I would think that it would add some measure of structural support for the via if we left it in place.  Am I wrong?

Thanks,
David Bealer

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