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January 2013

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Tue, 1 Jan 2013 16:17:19 +0000
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text/plain
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Thermal shock -55 to 150 C. 
--------------------------
Sent using BlackBerry


----- Original Message -----
From: Ramakrishnan Saravanan [mailto:[log in to unmask]]
Sent: Tuesday, January 01, 2013 11:09 AM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] reliability test for PCBs

Dear all, 

The test method 2.4.13.1 specifies  test method that is designed to determine the thermal integrity of unclad or metallic clad laminates using short-term solder exposure. My interest is to find the toughest know standard for PTH integrity. regards,


R.Saravanan

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