Assuming, that mounting hole is represented by washer OD on the picture and IC is a leaded component, IC location should not be a problem. However, I would try to place it (in this particular case) symmetrically as possible in relation to the mounting hole. 
The worry is - solder joints of IC and body of crystal cracking due to board flexing during and after the hardware torque. Board flexing depends on its thickness. If it is .094 - both locations should not be a problem.
The same is applicable for the placement of Multilayer Ceramic Capacitors with case 1210 and larger. There are no specific guidelines. However, some capacitor manufacturers recommend .2 inch away from the area of stress.       

Veronika Anderson C.I.D | Sr. Electrical/Mechanical Designer | Excelitas Technologies

Office:  +1 626.967.9521 x 236
1330 East Cypress Street, Covina, CA 91724 USA 
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www.excelitas.com

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Tuesday, January 15, 2013 7:44 AM
To: [log in to unmask]
Subject: [DC] Component to Mounting Clearance

Is there any guidance in IPC publications about acceptable clearance between components and mounting hardware? I can't find anything, but one of our designs has a QFP144 near a screw (more than 100 mils), and someone is wondering if it will be a problem.

Here is a partial picture:
http://frontdoor.biz/PCBportal/QFP144mtg.gif

There's also a crystal to the left of the mounting hole, and they were wondering about that one, too. Should I be worried?

(always feelin' like "the new guy")
Jack


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