Folks,
Again I state my inquiry, " Can/theatrically excessive saturation of the SMT components-BGA, etc. devices with the above stated product can a leakage condition". I don't feel I got an answer. I am very aware that the placement of the paste should only be over the die surface and with a control volume. I don't have the brand and/or composition make of the gray material before me, only the aftermath effects of the component /BGA over saturation.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nutting, Phil
Sent: Wednesday, January 30, 2013 9:05 AM
To: [log in to unmask]
Subject: Re: [TN] Gray Thermal Heat Sink Compound-paste
Hi guys,
In our testing the type of thermal paste does not make a difference if the surfaces are really smooth (16 µin or better surface). Where it makes a difference is in rougher surfaces. And Brian is right, more is not better.
For electrical isolation we have switch from a thixotropic phase change material (Isostrate) to T-gard with great results.
Just my 2 ¢
Phil
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Wednesday, January 30, 2013 9:52 AM
To: [log in to unmask]
Subject: Re: [TN] Gray Thermal Heat Sink Compound-paste
It depends.... on its composition. If it's grey, it may rely on fine metallic powder. I have some Thermaltake TG2 which the makers claim has low electrical conductivity but I suspect it may have metal in it. I use it for CPUs to radiators, so its electrical characteristics are unimportant. Consult the manufacturer's data. BTW, don't put on an excess; if it squeezes out, you're wasting a costly product :(
Brian
On 30/01/2013 15:41, Victor Hernandez wrote:
> Folks,
>
> Can excessive saturation of the SMT components-BGA, etc. devices with the above stated product can a leakage condition. Cosmetic wise it doesn't look pretty. I am concern functionally over a long period of time.
>
> Victor,
>
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