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December 2012

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Subject:
From:
Phil Bavaro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 11 Dec 2012 18:11:40 +0000
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Dymax 628 gel uv or else Loctite chipbonder.  628 bonds stronger but chipbonder is designed for reflow temps.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Tuesday, December 11, 2012 10:04 AM
To: [log in to unmask]
Subject: [TN] Sugestions for Pre Reflow Component Adhesive

Hi,



Can anyone make suggestions on an adhesive to hold down components while they go through the reflow oven?



I plan on using some SMT dual row .025 posts. I get them with locating pins but they still rock some. I was thinking of placing a drop of cyanoacrylate (Super Glue Gel) but that stuff gives off terrible odors at high temps. I don't think it was designed for reflow temps.



Any Suggestions?



Thanks,

Bob K.







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