Hi Ken,

Just trying to understand the purpose of wanting to do this before/while the 
board is reflowed.  You stated this will be a component of a larger board, 
and I do understand wanting to establish a brand to the board with a company 
logo and part number, but I'm also thinking about what it would take to do 
that even with a material that would withstand reflow.

Why not do it after the board is assembled, tested and known good? That 
would open up your options then....

Steve

-----Original Message----- 
From: Kenneth J. Wood
Sent: Monday, December 10, 2012 5:30 PM
To: [log in to unmask]
Subject: [TN] Polymer Lid

Hi all,
I need to design a polymer lid that gets glued on top of a square PCB.
The lid will be 0.66" x 0.66" by 0.20" (maybe 0.025" wall thickness) with a
flat top so I can have the company logo and part number printed on it.
The PCB itself is a system that gets soldered to a main board by way of
castellated holes.

My question is, what lid material should I use since this unit must go
through a reflow over?

I assume a vacuum formed CPVC lid would melt right?


The unit is somewhat similar in mechanical characteristics to a Linx module
like the TXM-xxx-es

https://www.linxtechnologies.com/resources/data-guides/txm-xxx-es.pdf



Thanks
Ken


_____________________________________
Kenneth J. Wood
Saturn PCB Design, Inc.
[log in to unmask]
www.saturnpcb.com



______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________ 


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________