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December 2012

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Subject:
From:
Robert Kondner <[log in to unmask]>
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Date:
Mon, 10 Dec 2012 17:58:20 -0500
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Kenneth,

 I looked into this some years back and any material that "Stands Up" to
reflow temps would be difficult to form. Injection molding would probably be
impossible but ask, don't take my word.

 At all costs is there any way to add it as a last step addition to a
finished PCB?

 How many are you talking about?

 I did have some plastic parts made from a thermoset. It was black material
and I forgot the trade name. It was probably just a phenolic material. Not
sure how well it takes reflow temps. If you need help contact me off line, I
will get you a sample. I had some 2 x 4 inch boxes and cover made.

Bob K. 






-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kenneth J. Wood
Sent: Monday, December 10, 2012 5:30 PM
To: [log in to unmask]
Subject: [TN] Polymer Lid

Hi all,
I need to design a polymer lid that gets glued on top of a square PCB.
The lid will be 0.66" x 0.66" by 0.20" (maybe 0.025" wall thickness) with a
flat top so I can have the company logo and part number printed on it.
The PCB itself is a system that gets soldered to a main board by way of
castellated holes.

My question is, what lid material should I use since this unit must go
through a reflow over?

I assume a vacuum formed CPVC lid would melt right?


The unit is somewhat similar in mechanical characteristics to a Linx module
like the TXM-xxx-es

https://www.linxtechnologies.com/resources/data-guides/txm-xxx-es.pdf



Thanks
Ken


_____________________________________
Kenneth J. Wood
Saturn PCB Design, Inc.              
[log in to unmask]
www.saturnpcb.com



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