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December 2012

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Subject:
From:
"Kenneth J. Wood" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kenneth J. Wood
Date:
Mon, 10 Dec 2012 17:30:12 -0500
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Hi all,
I need to design a polymer lid that gets glued on top of a square PCB.
The lid will be 0.66" x 0.66" by 0.20" (maybe 0.025" wall thickness) with a
flat top so I can have the company logo and part number printed on it.
The PCB itself is a system that gets soldered to a main board by way of
castellated holes.

My question is, what lid material should I use since this unit must go
through a reflow over?

I assume a vacuum formed CPVC lid would melt right?


The unit is somewhat similar in mechanical characteristics to a Linx module
like the TXM-xxx-es

https://www.linxtechnologies.com/resources/data-guides/txm-xxx-es.pdf



Thanks
Ken


_____________________________________
Kenneth J. Wood
Saturn PCB Design, Inc.              
[log in to unmask]
www.saturnpcb.com



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