Julie, Julie, Julie,
We're GUYS!  Where would be the fun if we didn't get side-tracked?!
Bev

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Julie Silk
Sent: Friday, December 07, 2012 2:43 PM
To: [log in to unmask]
Subject: Re: [TN] Termination finishes, Cu thickness under Ag, Au-Pt-Pd

Getting back to my problem (boy, you guys get sidetracked -- how about
starting a VPR discussion under a new thread??)

Wayne, You seem to be the primary person with hands on experience with
PtPdAu.  I appreciate the recommendation to burnish, but that's not
practical on a surface mount part.  (Maybe a new function could be added to
the pick-and-place machine to swipe the part over sandpaper?).  We are using
paste with SMT, but that's where we're seeing the wetting problem with the
PtPdAu.  We're not on a design that could use gold or welding.  Just trying
to solder these things onto a fairly normal PCB.  May well be these are
intended for attaching on thickfilm, although the manufacturer claims they
are good for soldering (and used by the millions).  We have confirmed that
the problem is wetting, not leaching.  Cleaning with solvent had no effect
on the wetting balance test.  Our CM didn't have anything to burnish them
with (and not enough imagination to find something, or no hardware/auto
supply stores in Malaysia?)

A few things in your post that I didn't understand:
"deliberately use an iron tip that doesn't wet well"??
"overlap must be behind a solder dam"?


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