TECHNET Archives

December 2012

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
MICRO ETCH
From:
Ramakrishnan Saravanan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ramakrishnan Saravanan <[log in to unmask]>
Date:
Sat, 22 Dec 2012 09:03:12 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines) 
Dear Mr ,

We have a in house facility for making hi reliability PCBs.

We use Park Nelco N4000-6 material (Tg=175 C ).

We use hot mounting techniques for PWB coupon micro section.

We polish up to 5 microns normally bur if a problem is found we go up to 0.05 micron polish.

We don't do micro etch. A Hi reliability PCB has failed in the field trials.

We analyzed  the coupon again  no problem found. We polished up to 1 microns  still no problem found.

But when we micro etched  the specimen we found a barrel separation.

Do the micro etch is essential in finding a fault?.

What are the false alarms possible and how to exclude ?

Kindly advise . regards.

Ramakrishnan Saravanan

ATOM RSS1 RSS2