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December 2012

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Subject:
From:
"Richard D. Krug" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard D. Krug
Date:
Fri, 21 Dec 2012 11:32:33 -0500
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We use step stencils occasionally, maybe 3-4% of stencils.  
We use both step down for fine pitch and occasionally step most of the board to use thicker stencil for intrusive solder of a connector.  

Dick Krug, CSSBB, CSMTPE
Senior Process Engineer
Sparton Complex Systems
30167 Power Line Road
Brooksville, FL  34602-8299
p (352) 540-4012  (Internal Ext. 2012)
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Craig Sullivan
Sent: Friday, December 21, 2012 10:33 AM
To: [log in to unmask]
Subject: [TN] Stepped Stencils

Just a poll to see how many assemblers out there are utilizing stepped stencils where a thinner stencil is required for ultra fine pitch or 0201 /
1005 components?

 

How much of your product mix requires a stepped stencil?

 

What are the draw backs and pitfalls?

 

Craig Sullivan

Manufacturing Engineer

MPL Incorporated

P: 607.266.0480 x115

F: 607.266.0482

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