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December 2012

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Subject:
From:
Bill Coleman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bill Coleman <[log in to unmask]>
Date:
Fri, 21 Dec 2012 16:22:10 +0000
Content-Type:
text/plain
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IPC 7525B has design guidelines for keep-out area between apertures in the step area to the step-up or step-down wall.

Bill

 
William E. Coleman Ph.D.
Vice President Technology
Photo Stencil
4725 Centennial Blvd.
Colorado Springs, CO 80919
Office:     719-535-8528
Cell:         719-331-2433
Fax:         719-599-4334


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
Sent: Friday, December 21, 2012 8:56 AM
To: [log in to unmask]
Subject: Re: [TN] Stepped Stencils

We need to step, or dispense occasionally, 5% of the time? 
If the component that requires less paste is too close to a component that requires thick paste, a stainless steel blade cannot flex quickly enough to drop into or pull out of the cavity and produce the desired print thickness.

Since we are a low volume shop, we usually minimize the print and add with dispensers. In high volume this would be slow. 

Guy

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Craig Sullivan
Sent: Friday, December 21, 2012 10:33 AM
To: [log in to unmask]
Subject: [TN] Stepped Stencils

Just a poll to see how many assemblers out there are utilizing stepped stencils where a thinner stencil is required for ultra fine pitch or 0201 /
1005 components?

 

How much of your product mix requires a stepped stencil?

 

What are the draw backs and pitfalls?

 

Craig Sullivan

Manufacturing Engineer

MPL Incorporated

P: 607.266.0480 x115

F: 607.266.0482

 <mailto:[log in to unmask]> [log in to unmask]

P Please consider the environment before printing this e-mail.

 

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