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December 2012

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Subject:
From:
Craig Sullivan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Craig Sullivan <[log in to unmask]>
Date:
Fri, 21 Dec 2012 10:32:36 -0500
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Just a poll to see how many assemblers out there are utilizing stepped
stencils where a thinner stencil is required for ultra fine pitch or 0201 /
1005 components?

 

How much of your product mix requires a stepped stencil?

 

What are the draw backs and pitfalls?

 

Craig Sullivan

Manufacturing Engineer

MPL Incorporated

P: 607.266.0480 x115

F: 607.266.0482

 <mailto:[log in to unmask]> [log in to unmask]

P Please consider the environment before printing this e-mail.

 

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