Dave, what do they base that apprehension on?
Inge

On 21 November 2012 23:27, David D. Hillman <[log in to unmask]>wrote:

> Hi gang! I have been looking for some data and am not having any great
> success so I thought I would ask TechNet! I am looking for solder joint
> integrity data for BGAs and CSPs where you have a two sided board and the
> BGAs or CSPs are "mirrored" (aka side one has a BGA exactly opposite of a
> BGA on side 2).  I have found publications discussing the impact of
> mirrored BGAs due to rework but I am looking more specifically for the
> influence of having a mirrored configuration  (or even a partially
> mirrored configuration) on the solder joint integrity in thermal cycle
> conditions. There seems to be some industry tribal knowledge that having a
> mirrored BGA/CSP configuration causes a degradation in solder joint
> integrity but I am not finding supporting data in the industry literature.
> If you know of any published papers/reports, please send me the citation
> and I can run down the papers.
>
> TIA
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
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