Maybe 3M HT700? http://multimedia.3m.com/mws/mediawebserver?mwsId=66666UF6EVsSyXTtmxfV5xT6EVtQEVs6EVs6EVs6E666666--&fn=78923671503.pdf Never used the stuff but might be worth a try.  Regards,Mike Sewell
 > Date: Tue, 11 Dec 2012 15:35:49 -0500
> From: [log in to unmask]
> Subject: Re: [TN] Sugestions for Pre Reflow Component Adhesive
> To: [log in to unmask]
> 
> Steve,
> 
>  The specified tooling holes are a little loose. I guess I could close up
> the holes but the posts do cock slightly. Problem is these will mate into
> another board so I want them to be straight. Just a slight cock and the long
> pin ends are really out of position. Worse yet they go on an aluminum based
> PCB so doing rework takes a lot of heat and is difficult.
> 
>  I have used thermosets before but was hoping there was a high temp
> "Instant" adhesive.
> 
> Thanks,
> Bob K.
> 
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> Sent: Tuesday, December 11, 2012 2:43 PM
> To: [log in to unmask]
> Subject: Re: [TN] Sugestions for Pre Reflow Component Adhesive
> 
> Hi Bob,
> 
> I have a question; what are the dual row connectors that you are using that
> rock during reflow? Dual row SMT headers usually have no problems sitting
> flush and perpendicular to the surface of the board as long as the footprint
> is correct. Is it the locating pin that they are pivoting on?
> 
> I will agree with everyone about using Loctite chipbonder. I've used 3609 to
> keep components from moving during reflow. For instance there were some
> D-paks where the lay-out of thermal (or ground pad) wasn't correct for the
> part, and the part would center itself over the thermal pad during reflow,
> which would pull the leads off their pads and result in no heel fillets. A
> dot of 3609 was hand dispensed so that it contacted the body of the part and
> the PCB, and it would cure enough before the solder went liquidous during
> reflow to overcome the surface tension of the solder and keep the part where
> it was placed. The board was later spun to fix that footprint and some
> issues.
> 
> Steve
> 
> -----Original Message-----
> From: Robert Kondner
> Sent: Tuesday, December 11, 2012 1:04 PM
> To: [log in to unmask]
> Subject: [TN] Sugestions for Pre Reflow Component Adhesive
> 
> Hi,
> 
> 
> 
> Can anyone make suggestions on an adhesive to hold down components while
> they go through the reflow oven?
> 
> 
> 
> I plan on using some SMT dual row .025 posts. I get them with locating pins
> but they still rock some. I was thinking of placing a drop of cyanoacrylate
> (Super Glue Gel) but that stuff gives off terrible odors at high temps. I
> don't think it was designed for reflow temps.
> 
> 
> 
> Any Suggestions?
> 
> 
> 
> Thanks,
> 
> Bob K.
> 
> 
> 
> 
> 
> 
> 
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