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December 2012

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Subject:
From:
"Rueda, Ernesto" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rueda, Ernesto
Date:
Tue, 11 Dec 2012 13:16:50 -0800
Content-Type:
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Loctite Chipbonder 3621 works well for me for reflow temps.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Bavaro
Sent: Tuesday, December 11, 2012 10:12 AM
To: [log in to unmask]
Subject: Re: [TN] Sugestions for Pre Reflow Component Adhesive

Dymax 628 gel uv or else Loctite chipbonder.  628 bonds stronger but
chipbonder is designed for reflow temps.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Kondner
Sent: Tuesday, December 11, 2012 10:04 AM
To: [log in to unmask]
Subject: [TN] Sugestions for Pre Reflow Component Adhesive

Hi,



Can anyone make suggestions on an adhesive to hold down components while
they go through the reflow oven?



I plan on using some SMT dual row .025 posts. I get them with locating
pins but they still rock some. I was thinking of placing a drop of
cyanoacrylate (Super Glue Gel) but that stuff gives off terrible odors
at high temps. I don't think it was designed for reflow temps.



Any Suggestions?



Thanks,

Bob K.







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