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December 2012

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Tue, 11 Dec 2012 14:42:53 -0500
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Hi Bob,

I have a question; what are the dual row connectors that you are using that 
rock during reflow? Dual row SMT headers usually have no problems sitting 
flush and perpendicular to the surface of the board as long as the footprint 
is correct. Is it the locating pin that they are pivoting on?

I will agree with everyone about using Loctite chipbonder. I've used 3609 to 
keep components from moving during reflow. For instance there were some 
D-paks where the lay-out of thermal (or ground pad) wasn't correct for the 
part, and the part would center itself over the thermal pad during reflow, 
which would pull the leads off their pads and result in no heel fillets. A 
dot of 3609 was hand dispensed so that it contacted the body of the part and 
the PCB, and it would cure enough before the solder went liquidous during 
reflow to overcome the surface tension of the solder and keep the part where 
it was placed. The board was later spun to fix that footprint and some 
issues.

Steve

-----Original Message-----
From: Robert Kondner
Sent: Tuesday, December 11, 2012 1:04 PM
To: [log in to unmask]
Subject: [TN] Sugestions for Pre Reflow Component Adhesive

Hi,



Can anyone make suggestions on an adhesive to hold down components while
they go through the reflow oven?



I plan on using some SMT dual row .025 posts. I get them with locating pins
but they still rock some. I was thinking of placing a drop of cyanoacrylate
(Super Glue Gel) but that stuff gives off terrible odors at high temps. I
don't think it was designed for reflow temps.



Any Suggestions?



Thanks,

Bob K.







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