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December 2012

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TechNet <[log in to unmask]>
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[log in to unmask], Paul Reid <[log in to unmask]>
Date:
Wed, 26 Dec 2012 02:39:08 -0600
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Ramakrishnan Saravanan <[log in to unmask]>
Subject:
Re: MICRO ETCH
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From:
Ramakrishnan Saravanan <[log in to unmask]>
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Dear Mr Reid,

Thank you for the reply. My understanding is if we polish too much , the fine copper smear may fill the separation and it will be very difficult to remove using microetch. 


What is the optimum level of polishing, whether we have to go down to 0.03 microns or can we stop it 1 micron polish before microetch. 


regards,


R.Saravanan

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