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December 2012

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Sat, 22 Dec 2012 09:03:12 -0600
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TechNet E-Mail Forum <[log in to unmask]>, Ramakrishnan Saravanan <[log in to unmask]>
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Ramakrishnan Saravanan <[log in to unmask]>
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Dear Mr ,

We have a in house facility for making hi reliability PCBs.

We use Park Nelco N4000-6 material (Tg=175 C ).

We use hot mounting techniques for PWB coupon micro section.

We polish up to 5 microns normally bur if a problem is found we go up to 0.05 micron polish.

We don't do micro etch. A Hi reliability PCB has failed in the field trials.

We analyzed  the coupon again  no problem found. We polished up to 1 microns  still no problem found.

But when we micro etched  the specimen we found a barrel separation.

Do the micro etch is essential in finding a fault?.

What are the false alarms possible and how to exclude ?

Kindly advise . regards.

Ramakrishnan Saravanan

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