TECHNET Archives

November 2012

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Joe Macko <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 13 Nov 2012 15:02:52 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (38 lines)
Hello,

 

I have been ask to look into the assembly  of an Interconnect Systems,
Inc (ISI) HiLo type 256 "Pin" base assembly into a mating HiLo "Socket"
base assembly (soldered to a PCB). I am looking for some information on
available manual tooling options to align and install the Pin base
assembly into the mating Socket base assembly as a 2nd ops type of
operation(after SMT). The manufacturer offers a Pin base removal tool
but nothing for installing the Pin base into the Socket. Estimated force
required to install is approx. 15 - 20 lbs. Prod rates are currently low
enough to only require a manual process such as the use of a small arbor
press type tool.

 

Appreciate any information.   Thx

 

Regards,

-Joe M.

 

 


"This e-mail and any attachments are solely for the use of the addressee and may contain L-3 proprietary information that may also be defined as U.S. Government export controlled technical data. If you are an unintended recipient of this e-mail, use, disclosure or distribution of its content is prohibited. Please notify the sender by return e-mail and immediately delete this message."
 

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2