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November 2012

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Subject:
From:
Amol Kane <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Amol Kane <[log in to unmask]>
Date:
Tue, 13 Nov 2012 16:04:31 +0000
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Hi,
We have this unusual (at least for me) request from a potential new customer. This is taken verbatim from their request for process information. Before I go and tell them this cannot be done, I want to ask the experts out on technet if they have seen/done something like this. My thinking is that this would be very hard to do on the floor unless there is a custom formulation available. I am not aware of their reasoning for asking this other than for a very unusual (and ineffective) way of mitigating tin whiskers. Leaving the potential flux incompatibilities aside, is this something that is being done/can be done? I could use some expertise or references/studies on # 2 as well.


1.       "Since our products are not subject to RoHS and our customer is not requiring lead mitigation, is there a vendor preferred process of Pb based or Pb-free processing.

a.       Describe your history/experience and process for adding ~3% Pb to Pb-free paste and utilizing Pb-free processes.

b.      Any quality or reliability concerns adding ~3% Pb to Pb-free soldering.

c.       Describe your history/experience and processes used in transitioning a product from Pb to Pb-free (or reduced Pb).

2.       Do you know of any issues with RoHS and reliability at -65C?"

Thanks,
Amol

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