Hi Bev - you are welcome! I learned long ago from my mentors that highly 
technical materials and solutions are not the exclusion domain of high 
tech products. Some of the simplest electronics have the most 
sophisticated materials and processes without us realizing it.

Dave



From:   Bev Christian <[log in to unmask]>
To:     "'TechNet E-Mail Forum'" <[log in to unmask]>, 
<[log in to unmask]>
Date:   11/06/2012 08:44 PM
Subject:        RE: [TN] Limits on flux residue



So on behalf of all those hundreds if not thousands of companies that do 
"no
clean" and do it right, we thank you Mr. Hillman for the compliment.

Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Tuesday, November 06, 2012 8:27 AM
To: [log in to unmask]
Subject: Re: [TN] Limits on flux residue

Hi Wayne - no, the JSTD-001 committee has not addressed that aspect of No 
Clean processing because there are a number of product use environment 
influences and process parameters that come into play on what is 
acceptable and unacceptable. Your description would lead me to believe 
that someone has taken extreme liberty in calling something a "no clean" 
process. One of the things that we have found most interesting in the 
implementation of a no clean process for a couple of our products is that 
many folks believe "no clean" is a sloppy process and you can leave flux 
residue anywhere on the assembly in uncontrolled quantities. But the 
reality is that "no clean" solder processing requires very careful control 

of what/how much/where you allow flux residues to exist. In my view, a "no 

clean" process actually is a much tighter controlled process than a 
process that utilizes cleaning to insure that product functionality is not 

impacted.

Dave Hillman
Rockwell Collins
[log in to unmask]



From:   "Thayer, Wayne - IS" <[log in to unmask]>
To:     <[log in to unmask]>
Date:   11/05/2012 05:52 PM
Subject:        [TN] Limits on flux residue
Sent by:        TechNet <[log in to unmask]>



Is there a spec somewhere which limits the amount of residue allowed for 
no clean processing?  I just saw a board where a BGA was about 70% 
"underfilled" by flux residue.  No, this was not a flux/underfill product! 

 A quick look at JSTD-001 Section 8 didn't seem to have specific guidance 
on this condition.

Wayne Thayer

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