Immersion is self limiting process, depend upon exposed based metal without contamination on the surface. If the surface is rough, you got more surface area, on XRF, the reading would be high compare to the relatively smooth flat surface. It depends surface roughness compare to the calibration std (usually smooth). My 2 cents. I am piggy (picky).
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From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, November 01, 2012 05:30 PM
To: TechNet E-Mail Forum <[log in to unmask]>; Joyce Koo
Subject: Re: [TN] ImAg thickness measurement / verification methods
Hi Joyce - Kevin has flat circuit boards and it was recommended that he must use calibrated standards. On what point is there a disagreement?
Dave
From: Joyce Koo <[log in to unmask]>
To: <[log in to unmask]>
Date: 11/01/2012 09:58 AM
Subject: Re: [TN] ImAg thickness measurement / verification methods
Sent by: TechNet <[log in to unmask]>
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Sorry to disagree. It only works with proper calibration std and your specimen plating is relatively flat. If your surface is very rough, you got error in reading (unless you use another method to validate)
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----- Original Message -----
From: Kevin Glidden [mailto:[log in to unmask]]
Sent: Thursday, November 01, 2012 10:35 AM
To: [log in to unmask] <[log in to unmask]>
Subject: Re: [TN] ImAg thickness measurement / verification methods
Thanks, everyone, for your responses. It appears XRF is a valid tool for measuring ImAg thickness.
I still have a need to have a few PCB samples analyzed. I have some PCBs that show ImAg copper-like discoloration after only 1 reflow cycle on the non-populated side. I would like to confirm what this discoloration is, and investigate / confirm if it is due to ImAg plating thickness or porosity issues.
Offline responses ok.
Thank you.
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