TECHNET Archives

November 2012

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Mon, 5 Nov 2012 19:30:50 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
Hi Wayne,

Was this from "normal" processing? Or was this a reworked BGA? I know tacky fluxes from rework can leave a lot of residue, but usually solder paste doesn't leave that much.

BTW, how did you see that the BGA was "underfilled" with all that residue?

Steve Gregory

 
    Teligent EMS
    102 Technology Way
    Havana, FL 32333
    (850) 539-2500 Ext.-237
    (850) 539-2509 FAX
 
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thayer, Wayne - IS
Sent: Monday, November 05, 2012 6:50 PM
To: [log in to unmask]
Subject: [TN] Limits on flux residue

Is there a spec somewhere which limits the amount of residue allowed for no clean processing?  I just saw a board where a BGA was about 70% "underfilled" by flux residue.  No, this was not a flux/underfill product!  A quick look at JSTD-001 Section 8 didn't seem to have specific guidance on this condition.

Wayne Thayer

________________________________

Email addresses of ITT Exelis employees have changed from itt.com to exelisinc.com. Please update your favorites and contact information to reflect these changes.

This e-mail and any files transmitted with it may be proprietary and are intended solely for the use of the individual or entity to whom they are addressed. If you have received this e-mail in error please notify the sender. Please note that any views or opinions presented in this e-mail are solely those of the author and do not necessarily represent those of Exelis Inc. The recipient should check this e-mail and any attachments for the presence of viruses. Exelis Inc. accepts no liability for any damage caused by any virus transmitted by this e-mail.

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________


This message and all attachments are intended for the use of the individual or entity to whom or which it is addressed and may contain information that is privileged, confidential, and exempt from disclosure. If the reader of this message is not the intended recipient or the agent responsible for delivering the message to the intended recipient, you are hereby notified that any dissemination, distribution, or copying of this communication is strictly prohibited. If you have received this e-mail in error, please notify me immediately at the number listed above.

U.S. export law as contained in the International Traffic In Arms Regulations (ITAR) and the Export Administration Regulations (EAR) may be applicable to any technical information submitted with this communication. This technical information is not to be placed in the public domain, exported from the U.S., or given to any foreign person in the U.S., without the prior, specific written authorization of TeligentEMS LLC and the U.S. Department of State or the U.S. Department of Commerce as applicable.

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2