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Date: | Wed, 28 Nov 2012 07:52:47 -0800 |
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Good morning.
I am trying to estimate the typical change in a solder ball's diameter
after reflow. IPC-7095B has great discussion about the typical change in
a ball's height after reflow but I did not see anything about
diametrical changes. Maybe there is another IPC document that addresses
this. Factors such as package weight, # of solder balls, ball alloy,
etc. influence collapse so I am sure there is no quick answer buy maybe
there is a rule of thumb to estimate the diametrical change.
Look forward to any advice. thx
Regards,
-Joe
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