Julie,

Yes, the addition of a small amount of Pt does slow up the rate of the conductors leaching into the solder.  From practical experience, the more Pt is added, the better the leach resistance.  However, the more Pt is added, the greater are wetting problems.

Thick film ink suppliers [used to] offer inks with different amounts of Pt so you could slightly 'chose your poison.'

Also can depend on whether it is a fritted, or a frit-less, system.

Like Mike says - BURNISH before solder IS the general rule!  

Never was something you really 'wanted' to solder to, unless you had no other choice.


Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
                         616 834 1883



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Julie Silk
Sent: Tuesday, November 27, 2012 8:02 PM
To: [log in to unmask]
Subject: Re: [TN] Termination finishes, Cu thickness under Ag, Au-Pt-Pd

The claim of the supplier is that the Pt prevents the Au from dissolving into the solder.  Hmmm.  Can anyone back that up? 
The recent info on this is that it's looking like a wettability problem more than a dissolving-into-the-joint problem, although neither is confirmed.

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________