Hi Julie - Yes, there is published data - look up Wally Bader's 
dissolution data in:

W. Bader, ?Dissolution of Au, Ag, Pd, Pt, Cu, and Ni in a Molten Tin-Lead 
Solder?, Welding Journal 48, 1969.

Also:

R.J. Klein Wassink,  Soldering in Electronics, ISBN 0-901150-14-2, Chapter 
4, page 114, element dissolution figure 4.19

Pt and Ni have about the same dissolution rates for eutectic tin/lead 
solder.

Dave Hillman
Rockwell Collins
[log in to unmask]



From:   Julie Silk <[log in to unmask]>
To:     <[log in to unmask]>
Date:   11/27/2012 07:04 PM
Subject:        Re: [TN] Termination finishes, Cu thickness under Ag, 
Au-Pt-Pd
Sent by:        TechNet <[log in to unmask]>



The claim of the supplier is that the Pt prevents the Au from dissolving 
into the solder.  Hmmm.  Can anyone back that up? 
The recent info on this is that it's looking like a wettability problem 
more than a dissolving-into-the-joint problem, although neither is 
confirmed.



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