Hmm. 
Yes the thickfilm guys have used Sn/Ag for years, long before it came to be
called Pb-free, and some suppliers claim to have low leach inks. Not totally
familiar with all their products, but I thought these claims related to
silver based products. Au thickfilms are not so common.
No doubt Steve or someone, (missing Inge here), can educate us in this zone.
Back to your mail.
If the pads are not wetting there won't be any dissolution.
I suggest you try some simple, pragmatic tests.
If you have a small solder pot, try dunking the components [with a little
flux] and see what happens. Next:
Gently brighten/abrade the terminations with fibreglass pencil. Or rub
against >600 grit carbide paper (wet and dry at your auto shop),
alternatively a piece of alumina. Then dunk as before.

Best Wishes
 
 
 
Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Julie Silk
Sent: Wednesday, November 28, 2012 1:02 AM
To: [log in to unmask]
Subject: Re: [TN] Termination finishes, Cu thickness under Ag, Au-Pt-Pd

The claim of the supplier is that the Pt prevents the Au from dissolving
into the solder.  Hmmm.  Can anyone back that up? 
The recent info on this is that it's looking like a wettability problem more
than a dissolving-into-the-joint problem, although neither is confirmed.



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