You can if you add a note on the fabrication drawing thereby making it a requirement, or make it part of a Statement of Work, or put it in the Purchase Order.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Tuesday, November 20, 2012 3:33 PM
To: [log in to unmask]
Subject: Re: [TN] FAB: Humidity Limits?

oops... I'm really embarrassed! 

I thought I was familiar with IPC-1601 (the packaging and storage part of it anyway) which is why I was searching EVERYWHERE ELSE for fabrication info, but now I discover that IPC-1601 discusses fabrication too.

I'm sorry for not doing enough homework first.

but if I could ask one question about it, I only have the Final Draft of the document and it is labelled as a "Guideline", but gives real recommendations such as specific baking parameters for various situations. 
My question is, can (or should) board purchasers REQUIRE adherence to 1601? 
Can we even do that (like with notes on a drawing) if the document is just a guideline? 

thanks,
Jack

.

On Tue, 20 Nov 2012 13:28:07 -0600, Jack Olson <[log in to unmask]> wrote:

>After reviewing the bare board packaging and shipping recommendations 
>in
>IPC-1601 (which addresses getting the boards from the fabricator to the
>assembler) the question came up about the humidity levels INSIDE the 
>fabricator DURING the fabrication.
>Does IPC address that? Maybe I haven't had enough coffee today, but a 
>search for "moisture" or "humidity" in IPC-6012, IPC-A-600, etc didn't 
>reveal very much useful info. Are we trying to control that? Or just 
>the moisture level in the finished product?
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