Ok, here is one that is news to me.......

We have an effort going on that involves measuring the radiation that an x-ray inspection system exposes to space application hardware.

I was surprised to find that there are a few papers online speaking relatively to this issue and one dated as early as 2007.

The issue seems to be that components without a lot of Radiation Design Margin (RDM) may get their margin used up during assembly inspection operations if the exposure exceeds a certain number of kRad(Si).

I know I have been out of the loop for Class 3A Space hardware for a while, but I find it hard to believe that x-ray inspection has the potential to damage any hardware.

What kind of controls do the rest of you have in place to account for this potential assembly nightmare?  I know many of us are building Space hardware with BGAs, QFNs, etc but now I am wondering how do you know that a given part is ok to put through the x-ray inspection machine.

I guess I should be happy.....it isn't everyday that I learn something new.
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