oops... I'm really embarrassed! 

I thought I was familiar with IPC-1601 (the packaging and storage part of it anyway)
which is why I was searching EVERYWHERE ELSE for fabrication info, but now I discover
that IPC-1601 discusses fabrication too.

I'm sorry for not doing enough homework first.

but if I could ask one question about it, I only have the Final Draft of the document and
it is labelled as a "Guideline", but gives real recommendations such as specific baking
parameters for various situations. 
My question is, can (or should) board purchasers REQUIRE adherence to 1601? 
Can we even do that (like with notes on a drawing) if the document is just a guideline? 

thanks,
Jack

.

On Tue, 20 Nov 2012 13:28:07 -0600, Jack Olson <[log in to unmask]> wrote:

>After reviewing the bare board packaging and shipping recommendations in
>IPC-1601 (which addresses getting the boards from the fabricator to the
>assembler) the question came up about the humidity levels INSIDE the
>fabricator DURING the fabrication.
>Does IPC address that? Maybe I haven't had enough coffee today, but a
>search for "moisture" or "humidity" in IPC-6012, IPC-A-600, etc didn't
>reveal very much useful info. Are we trying to control that? Or just the
>moisture level in the finished product?
___________________________________________________________________