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November 2012

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Subject:
From:
Gerald Bogert <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 16 Nov 2012 07:55:06 -0500
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November 16, 2012

 

Many different OEMs are currently performing environmental stress
screening (ESS) testing of various types as performed on circuit cards
or modules.  Some do ESS for temperature cycling only.  Some do ESS for
vibration only  Some do both temperature and vibration.

 

I am trying to gain some information on the number of test failures
folks are finding when doing ESS testing.   I would appreciate any
metrics you can provide as follows:

 

1.     How many total circuit cards or other assemblies are tested on an
annual basis?

2.     How many of these were subjected to ESS testing?

3.     What type of ESS testing was used (e.g., temperature cycle,
vibration, temperature plus vibration)?

4.     How many circuit cards failed?

 

I am trying to get some bench marks to compare failure rates using ESS
testing versus just doing full load testing at ambient temperature for a
fixed time period (e.g., 24 hours, 100 hours, etc.).  My understanding
is that failures found by full load/operating test are normally <1%
whereas, for the same product, ESS failure rate is around 1 to 3%.


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