TECHNET Archives

November 2012

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
X-To:
Date:
Tue, 13 Nov 2012 07:56:24 -0600
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Message-ID:
Subject:
From:
Victor Hernandez <[log in to unmask]>
MIME-Version:
1.0
In-Reply-To:
Content-Transfer-Encoding:
base64
Content-Type:
text/plain; charset="utf-8"
Parts/Attachments:
text/plain (1 lines)
What type of rework flux?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Julie Silk
Sent: Tuesday, November 13, 2012 7:49 AM
To: [log in to unmask]
Subject: [TN] Reflux and reflow BGA rework

A discussion of the practice of re-flux and reflow of BGAs to rework them has emerged within the "limits of flux residue" discussion.  I'm taking it out into a separate thread.  This rework process injects flux under the BGA, then reflows the BGA.  The part is not removed.  It will frequently make a part that wasn't working work again.  The heat damage to the board is less (fewer cycles) than a replacement process.  The question Joyce asked about whether there are standards and reliability studies has not been answered.  What is the proper procedure for this rework process?  Are there official standards?  Studies of effectiveness / reliability?

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2