http://www.ipcoutlook.org/pdf/inspection_improve_lead_free_solder_smta.pdf
Joyce Koo
Materials Researcher - Materials Interconnect Lab
Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Reuven Rokah
Sent: Monday, October 29, 2012 3:03 PM
To: [log in to unmask]
Subject: Re: [TN] Collapsed height for BGAs
Hi Ioan,
Its depend on the component weight, number and diameter of balls, Alloy of
ball / paste.
You will need a sample for a good design.
2/3 of the original height is a good estimation.
Reuven
On Mon, Oct 29, 2012 at 4:31 PM, Ioan Tempea <[log in to unmask]> wrote:
> Dear Technos,
>
> For heatsink attachment purposes, is there any way of knowing what the
> collapsed height of BGA balls will be after soldering? Best would be to
> measure, but I don't have the products and, anyways, the population of
> boards was rather scarce.
>
> Thanks,
>
> Ioan Tempea, ing.
> Ingénieur principal de fabrication / Senior Manufacturing Engineer
> [signature002]<http://www.digico.cc/>
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