Does anyone know of a way to remove the epoxy that is used to cover CoB
ICs, while maintaining the integrity of the PWB-CoB Assembly afterwards?
I have tried hot Nitric Acid, which does remove the epoxy nicely, but
also removed the copper on the PWB and swelled during the decap process
and ruptured the bondwires.  I believe Red Fuming Nitric would also
swell the epoxy lifting the bondwires.  Most aggressive solvents don't
remove epoxies well. So I am pout of ideas at present.

Thanks,
mark

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