Hi ioan,

I don't think you can control the height by playing with a re-flow profile (only by stencil thickness) and that is not what I'd be concerned about, but rather about the component warpage.
Regards,

Vladimir

SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca

-----Original Message-----
From: Ioan Tempea <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Mon, 29 Oct 2012 14:31:57 
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
        Ioan Tempea
	<[log in to unmask]>
Subject: [TN] Collapsed height for BGAs

Dear Technos,

For heatsink attachment purposes, is there any way of knowing what the collapsed height of BGA balls will be after soldering? Best would be to measure, but I don't have the products and, anyways, the population of boards was rather scarce.

Thanks,

Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer
[signature002]<http://www.digico.cc/>

950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f>
T+ 1 (450) 967-7100, EXT244
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