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October 2012

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Mon, 29 Oct 2012 14:31:57 +0000
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Dear Technos,

For heatsink attachment purposes, is there any way of knowing what the collapsed height of BGA balls will be after soldering? Best would be to measure, but I don't have the products and, anyways, the population of boards was rather scarce.

Thanks,

Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer
[signature002]<http://www.digico.cc/>

950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f>
T+ 1 (450) 967-7100, EXT244
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Entreprise manufacturière / Gestion du capital humain


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